ASML to launch High-NA lithography machines to boost chip manufacturing
The new machines will allow producing of smaller, more powerful chips.
Published on January 30, 2025
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ASML is set to change the landscape of semiconductor production with the introduction of its High-Numerical Aperture (NA) lithography machines, particularly the TWINSCAN EXE:5200. This cutting-edge technology, boasting a numerical aperture of 0.55 compared to the traditional 0.33, paves the way for transistors 1.7 times smaller and an increased packing density by 2.9 times, allowing for the production of more powerful chips.
Scheduled for release in early 2025, the EXE:5200 will first be delivered to Intel's Oregon facility, marking a substantial leap in chipmaking capabilities. This development is crucial as the technology promises advancements that align with Moore's Law, a guideline essential for Intel, TSMC, and Samsung's competitive edge in the global market. Beyond 2025, ASML aims to further enhance these capabilities with hyper-NA technology. The logistical feat of delivering such technology, involving extensive shipping resources, underscores its complexity and significance.
Industry impact and market dynamics
The implementation timeline varies among major semiconductor manufacturers. Intel leads the adoption curve, planning to integrate the technology into its 14A process with mass production scheduled for 2025-2026. TSMC, commanding a 61.7% global market share, is expected to follow shortly after, incorporating the technology into its 2-nm node production. Samsung has also expressed keen interest in the technology, particularly as the industry navigates complex market dynamics and increasing demand for advanced chip manufacturing capabilities.
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Future trajectory and financial outlook
ASML's commitment to innovation extends beyond the current high-NA technology. The company has been developing this technology since 2014 and is already considering future hyper-NA EUV machines with a numerical aperture of 0.75, which could become particularly relevant around 2031 with the introduction of complementary field-effect transistors (FETs). Financially, ASML projects robust growth, with expected total net sales for 2025 between €30 billion and €35 billion, reflecting the increasing demand for their advanced lithography solutions.
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Logistical and implementation challenges
The deployment of these sophisticated machines presents significant logistical challenges. Each system requires over 250 transport crates, multiple cargo planes, and 20 semi-trailer trucks across 43 freight containers for delivery. The implementation demands stricter standards for cleanroom environments and higher precision in manufacturing components, highlighting the complexity of advancing semiconductor manufacturing capabilities.