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FononTech secures €8.5 million seed round, delivers first machine

The new funds are used to finalize the first product and develop customer traction. FononTech expects to close a new round later this year.

Published on May 18, 2025

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© Fonontech

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FononTech, the company behind Impulse Printing, a breakthrough 3D integration solution for AI-capable and miniaturized consumer electronics, has secured a €8.5 million ($9.5 million) seed investment. Sake Bosch led the round, which also included participation from Innovation Industries, Brabant Development Agency (BOM), TNO, SHIFT Invest, and grant funding from EIC Accelerator.

Fonontech is a former Gerard & Anton award winner.

FononTech’s Impulse Printing technology is said to be the fastest and most cost-effective solution for 3D interconnects in the semiconductor packaging industry - a critical enabler for edge AI devices. The new funds are being used to finalize the first product and develop customer traction. FononTech expects to close a new round later this year to scale quickly with in-house production.

Customer interest

CEO and co-founder Rob Hendriks says the commitment of the investor team has enabled his company to move quickly and convert market traction into sales. "In just 2 years, we successfully delivered our first machine to a major semiconductor company." CTO and co-founder Fabien Bruning added that it is great to see the customer interest accelerate so quickly. "There are already signs that our solution is being recognized as a key solution to integration and performance challenges, especially in advanced packaging."

Sake Bosch: “FononTech is creating a new equipment category, not only in semiconductors, but also in the display industry. With over 100 years of experience in the leadership team and sales  potential of €1 billion within 5 years, we have exciting times ahead."

Holst Centre

Founded in 2023 as a spin-off from Dutch technology organization TNO Holst Centre, FononTech is based in Eindhoven, The Netherlands, and has sales offices in South Korea, Japan, and North America. With an extensive patent portfolio, the company aims to reshape the future of electronics manufacturing by addressing the growing demand for compact, AI-capable devices.