{"id":422441,"date":"2022-11-16T22:55:00","date_gmt":"2022-11-16T21:55:00","guid":{"rendered":"https:\/\/innovationorigins.com\/?p=422441"},"modified":"2022-11-16T22:55:00","modified_gmt":"2022-11-16T21:55:00","slug":"mixing-and-matching-electronics-and-integrated-photonics-its-already-here-but-the-road-ahead-is-still-unclear","status":"publish","type":"post","link":"https:\/\/ioplus.nl\/archive\/en\/mixing-and-matching-electronics-and-integrated-photonics-its-already-here-but-the-road-ahead-is-still-unclear\/","title":{"rendered":"Mixing and matching electronics and integrated photonics: it\u2019s already here, but the road ahead is still unclear"},"content":{"rendered":"\n
Why we write about this topic:<\/summary>

Integrated Photonics is a key technology that will enable many innovations in the coming years. In a series of 5 articles we look back on the Photonics PIC Summit Europe. Read the other articles, once published, here<\/a>.<\/p><\/div><\/details>\n\n\n\n

Two panel sessions during this year\u2019s PIC Summit Europe 2022<\/a> were devoted to the heterogeneous integrations between various parts of electronics and photonics. Expertise from all corners of the value chain was brought together to find out about the current state of the industry, as far as co-design, co-simulation, and co-production of electronic and photonic circuits are concerned.<\/p>\n\n\n\n

With the growing maturity of fabrication processes for PICs, true process design kits are now being set up which include process statistics that allow design for manufacturability. In addition, there\u2019s a growing convergence with electronic design tools, for co-simulation. These trends open up new directions for the field. Additionally, the increasing global demand for communication and computing technology puts pressure on chip manufacturers. The industry is aware that monolithic technology alone is not enough to handle that pressure. The answers are sought in a smart combination of materials, and both photonic and electronic circuitry. The field of heterogeneous integration is exploring techniques like \u2018die and wafer bonding\u2019, and \u2018micro-transfer printing\u2019.<\/p>\n\n\n\n

Many sideways<\/h2><\/div>\n\n\n\n

What does this entail? What does the future hold for photonic and electronic co-design? Well, the industry is not sure yet. Those who watched the sessions – led by Martijn Heck of TU Eindhoven<\/a> and Michael Lebby of Lightwave Logic<\/a> – found themselves in a very nuanced place. Yes, we\u2019re on our way, but the road ahead still has many sideways. \u201cAnd we will decide which path to choose along the way.\u201d <\/p>\n\n\n\n

Mixing and matching are already here, Michael Lebby concluded. \u201cIt\u2019s going to happen, if only because the industry will keep looking for better performances. But there are many approaches, many applications, many combinations – we still have to sort out which will be most effective. We can be certain that there\u2019s a whole bunch of opportunities that will use a whole bunch of combinations.\u201d <\/p>\n\n\n

<\/a>
<\/div><\/div>
In recent years, under the leadership of PhotonDelta, a solid foundation has been laid under the Dutch integrated photonics ecosystem. Read all about the applications here.<\/div>
Your Sneak Preview of the Future<\/div><\/div><\/div>\n\n\n

For Martijn Heck, it was hard to formulate a key takeaway from his session. \u201cWhat we discussed is more of an assessment than it would be a takeaway: we are moving forward together, and we have a common goal, but we need more time to find out what the ideal road to success exactly looks like. So I would like to ask the whole photonics community to engage with us to assess where we are at the moment and how we can find the best road ahead.\u201d<\/p>\n\n\n\n

The scattered views also became clear when Mr. Heck asked the audience to join the discussion. \u201cHow do you think electronics and photonics will go together in one system\u201d, he wanted to know. \u201cDo you see a solution in multiple dies (chips) assembled together with flip-chip or wire-bond approaches, in more heterogeneous approaches, using micro-transfer printing, die and wafer bonding, or rather in monolithic solutions where electronics and photonics are fabricated on the same substrate?\u201d Dozens of hands went in the air for every one of the potential answers. Plus the suggestion for another option: \u201cAll of the above.\u201d<\/p>\n\n\n\n

Designing a product<\/h2><\/div>\n\n\n\n

The audience\u2019s view was exemplary for the discussion within the two panels. Packaging was positioned as a good option for integration, as was an interface to communicate between systems. What the panels did agree upon is that it all comes down to the actual use: the functions and applications will be decisive for the way the integration process will proceed. \u201cThis is about designing a product, not a chip\u201d, Katarzyna Lawnizcuk (Bright Photonics<\/a>) said. <\/p>\n\n\n\n

Another point of agreement was in the complexity of the circumstances around the integration initiatives. \u201cThe electronics and photonics communities still are mostly separate worlds, with the latter far less mature than the first, but you have to solve everything simultaneously.\u201d Bridging those communities is one of the big tasks for now, but even so, Lebby remained assured: \u201cIt\u2019s going to happen.\u201d<\/p>\n\n\n\n

PIC Summit Europe 2022<\/em><\/a> is a new congress, one of two photonic chip conferences in Europe and will return annually. It is expected to take place again next year in November. <\/em>PhotonDelta<\/em><\/a> is the lead organizer of the congress; the program was set up together with the <\/em>Eindhoven University of Technology<\/em><\/a> and <\/em>IPSR-I<\/em><\/a>.<\/em><\/p>\n","protected":false},"excerpt":{"rendered":"

Two panel sessions during this year\u2019s PIC Summit Europe 2022 were devoted to the heterogeneous integrations between various parts of electronics and photonics. Expertise from all corners of the value chain was brought together to find out about the current state of the industry, as far as co-design, co-simulation, and co-production of electronic and photonic […]<\/p>\n","protected":false},"author":1568,"featured_media":511620,"comment_status":"open","ping_status":"closed","sticky":false,"template":"views\/single-partner.blade.php","format":"standard","meta":{"_acf_changed":false,"advgb_blocks_editor_width":"","advgb_blocks_columns_visual_guide":"","footnotes":""},"categories":[8553],"tags":[2874,6597,74618],"location":[6763],"article_type":[43139],"serie":[],"archives":[],"internal_archives":[],"reboot-archive":[],"class_list":["post-422441","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-digital","tag-fotonica","tag-photondelta","tag-pic-summit-2022","location-netherlands","article_type-features"],"blocksy_meta":[],"acf":{"subtitle":"What does the future hold for photonic and electronic co-design? Well, the industry is not sure yet. The roadmap ahead still has many sideways.","text_display_homepage":false},"author_meta":{"display_name":"Bart Brouwers","author_link":"https:\/\/ioplus.nl\/archive\/author\/brewbart\/"},"featured_img":"https:\/\/ioplus.nl\/archive\/wp-content\/uploads\/2022\/11\/panel-session-PIC-Summit-2022.jpeg","coauthors":[],"tax_additional":{"categories":{"linked":["Digital<\/a>"],"unlinked":["Digital<\/span>"]},"tags":{"linked":["fotonica<\/a>","PhotonDelta<\/a>","PIC Summit 2022<\/a>"],"unlinked":["fotonica<\/span>","PhotonDelta<\/span>","PIC Summit 2022<\/span>"]}},"comment_count":"0","relative_dates":{"created":"Posted 3 years ago","modified":"Updated 3 years ago"},"absolute_dates":{"created":"Posted on November 16, 2022","modified":"Updated on November 16, 2022"},"absolute_dates_time":{"created":"Posted on November 16, 2022 10:55 pm","modified":"Updated on November 16, 2022 10:55 pm"},"featured_img_caption":"","series_order":"","_links":{"self":[{"href":"https:\/\/ioplus.nl\/archive\/wp-json\/wp\/v2\/posts\/422441","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/ioplus.nl\/archive\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/ioplus.nl\/archive\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/ioplus.nl\/archive\/wp-json\/wp\/v2\/users\/1568"}],"replies":[{"embeddable":true,"href":"https:\/\/ioplus.nl\/archive\/wp-json\/wp\/v2\/comments?post=422441"}],"version-history":[{"count":0,"href":"https:\/\/ioplus.nl\/archive\/wp-json\/wp\/v2\/posts\/422441\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/ioplus.nl\/archive\/wp-json\/wp\/v2\/media\/511620"}],"wp:attachment":[{"href":"https:\/\/ioplus.nl\/archive\/wp-json\/wp\/v2\/media?parent=422441"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/ioplus.nl\/archive\/wp-json\/wp\/v2\/categories?post=422441"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/ioplus.nl\/archive\/wp-json\/wp\/v2\/tags?post=422441"},{"taxonomy":"location","embeddable":true,"href":"https:\/\/ioplus.nl\/archive\/wp-json\/wp\/v2\/location?post=422441"},{"taxonomy":"article_type","embeddable":true,"href":"https:\/\/ioplus.nl\/archive\/wp-json\/wp\/v2\/article_type?post=422441"},{"taxonomy":"serie","embeddable":true,"href":"https:\/\/ioplus.nl\/archive\/wp-json\/wp\/v2\/serie?post=422441"},{"taxonomy":"archives","embeddable":true,"href":"https:\/\/ioplus.nl\/archive\/wp-json\/wp\/v2\/archives?post=422441"},{"taxonomy":"internal_archives","embeddable":true,"href":"https:\/\/ioplus.nl\/archive\/wp-json\/wp\/v2\/internal_archives?post=422441"},{"taxonomy":"reboot-archive","embeddable":true,"href":"https:\/\/ioplus.nl\/archive\/wp-json\/wp\/v2\/reboot-archive?post=422441"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}